AFM-3000

The Semilab AFM-3000 system is designed for various applications, including:

1. Particle Inspection:

   • Precise defect localization through the light scattering method (μPIT).
   • Defect inspection using a high-resolution AFM scanner based on imported KLARF files.

2. CMP Process Control:

   • Consistent and highly reproducible roughness characterization for quality control of semiconductor wafers up to 12″ (300 mm).

3. Critical Dimension AFM:

   • Provides detailed 3D sample surface information on micro and nano scales.
   • Suitable for silicon and non-silicon wafers, thin films, and surfaces with nanotopography.

Key Features:

• Provides high-resolution, sub-atomic precision measurements with extremely low noise levels.
• Ensures stable and accurate performance in a customizable, user-friendly environment.
• Offers vibration isolation and supports variable cantilever types with outstanding scan rates.
• Equipped with a wafer contour meter for repeatable and precise alignment.
• Includes a full wafer AFM profilometer mode.
• Optional advanced defect review capability, combining high-resolution AFM measurement with micro-particle inspection metrology (mPIT) for immediate defect determination.
• Features pattern recognition.
• Provides a low-noise platform.
• Offers flexibility with AFM tip scanner setup for a wide scanning range.
• Accommodates sample sizes up to 300 mm.

Specifications: 

• Automated system with a new platform, featuring fully automated sample loading, data evaluation, and factory integration.
• Low noise platform with high-performance acoustic and active vibration isolation.
• Precise positioning stage.
• µPIT capability for the precise localization of defects.
• Customizable Software with KLARF defect file import.
• Full wafer area accessibility.
• Optional features such as
  • pattern recognition,
  • advanced defect review,
  • cantilever exchange with tip qualification (up to 10,000 tip exchanges without failure), and
  • environmental control module.
• Sample size support for up to 300 mm.
• Sample handling options include
  • automated dual loadport,
  • open cassette (adaptors, no edge-grip possibility), and
  • FOUP.

The AFM-3000 is ideal for various industry quality control applications, including:

• Wafer makers and device makers in the semiconductor industry for quality inspection.
• Roughness measurement of samples after CMP (Chemical Mechanical Polishing).
• Defect inspection and localization.
• Research centers involved in nano-imaging and defect inspection.

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