AJA Multi-Wafer Sputter Deposition Services — ATC-2200-UHV

AJA provides multi-wafer sputter deposition services using the ATC-2200-UHV sputter-up system, designed for larger substrates, automated runs, process development, and pilot-scale thin film deposition.

The system supports substrates up to 8 inches in diameter and can also accommodate multiple smaller substrates using dedicated holders. It includes a six-position auto-loading cassette for fully automated runs and is equipped with five UHV sputtering sources using 4-inch targets.

The service supports DC and RF sputtering, RF and DC substrate biasing, QCM deposition rate calibration, and reactive sputtering with Ar, N₂, and O₂ gases. Substrate heating up to 800°C is available, making this service suitable for advanced thin film process development, materials screening, and wafer-scale coating work.

In-situ thin film monitoring using k-Space ICE is available for selected deposition processes, supporting real-time monitoring of film growth, thickness, growth rate, optical properties, stress, and substrate curvature.