Applications:
- 2D and 3D imaging and analysis of conductive and nanoconductive materials with using of local charge compensator
- Ultra thin lamella preparation (<50 nm) for TEM (at any location of materials which are extremely difficult to prepare with another way – worm surfaces, oxidation, under the indenter…)
- Milling, implantation, ion-induced deposition, ion assisted etching of materials
FIB lithography - Analysis of cross sections, sub surfaces damage, cracking, oxidation, wear, corrosion, study of profile and associated plastic deformation of nanoindentations etc.
- Preparation of micro pillars for further nanomechanical testing
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